Memory module, main board, and server device
US12079146B2 · kind B2 · utility
0Cited by
34References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 22, 2021 |
| Grant date | Sep 3, 2024 |
| Priority date | — |
| Expiry date | May 21, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11C7/1063
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A memory module includes a memory substrate including a main connector and an auxiliary connector, configured to be connected to an external device; and a plurality of memory chips mounted on at least one of a first surface or a second surface of the memory substrate, wherein the main connector is disposed on one side of the memory substrate, and the auxiliary connector is disposed on the second surface of the memory substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.