Light-emitting diode packaging module

US12080688B2 · kind B2 · utility

Assignee

• QUANZHOU SANAN SEMICONDUCTOR TECHNOLOGY CO., LTD · CN

Inventors

• Zhen-Duan Lin · Xiamen, CN
• Yanqiu LIAO · Fujian, CN
• Shuning Xin · Xiamen, CN
• Weng-Tack WONG · Fujian, CN
• Junpeng SHI · Xiamen, CN
• Aihua Cao · Fujian, CN
• Changchin YU · Xiamen, CN
• Chi-Wei Liao · Hsinchu, TW
• Chen-ke HSU · Xiamen, CN
• Zheng Wu · Fujian, CN
• Chia-En Lee · Taipei, TW

Key dates

• Filing date: Jan 19, 2022
• Grant date: Sep 3, 2024
• Expiry date: Mar 12, 2043

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/857
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A light-emitting diode (LED) packaging module includes LED chips, a wiring layer, and an encapsulant component. Each of the LED chips includes a chip first surface, a chip second surface, a chip side surface, and an electrode unit. The wiring layer is disposed on the chip second surfaces of the LED chips, and contacts and is electrically connected to the electrode units. The encapsulant component includes a first encapsulating layer that covers the chip side surface, and a second encapsulating layer that covers the wiring layer. The LED chip has a thickness TA, the first encapsulating layer has a thickness TB, in which TB/TA≥1.