Methods and devices for microelectromechanical resonators
US12081192B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 26, 2023 |
| Grant date | Sep 3, 2024 |
| Priority date | — |
| Expiry date | May 26, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H2009/2442
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A MEMS device may include: (i) a lower cavity, including a first island, formed within a first layer of the MEMS device; (ii) an upper cavity, including a second island, formed within a second layer of the MEMS device; (iii) a MEMS resonating element arranged in a device layer of the MEMS device and anchored via the first and second islands; (iv) a first set of electrodes for electrostatic actuation and sensing of the MEMS resonating element in an in-plane mode that is arranged in the device layer of the MEMS device; and (v) a second set of electrodes for electrostatic actuation and sensing of the MEMS resonating element in an out-of-plane mode that is electrically isolated from the first set of electrodes and located in the first or second layer of the MEMS device, and wherein the out-of-plane mode is a torsional mode or a saddle mode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.