Surface acoustic wave (SAW) device with one or more intermediate layers for self-heating improvement

US12081199B2 · kind B2 · utility

Assignee

• RF360 Singapore Pte. Ltd. · SG

Inventors

• Tomasz Jewula · Borgo San Lazzaro, DE
• Matthias HONAL · Munich, DE

Key dates

• Filing date: Jan 13, 2022
• Grant date: Sep 3, 2024
• Expiry date: Oct 16, 2042

Classification

• Technology area (CPC H): Electricity
• CPC primary: H03H9/14541
• WIPO field: Basic communication processes
• WIPO sector: Electrical engineering

Abstract

Certain aspects of the present disclosure provide a surface acoustic wave (SAW) device with one or more intermediate layers for reduced self-heating and methods for fabricating such a SAW device. One example SAW device generally includes a piezoelectric layer and an interdigital transducer (IDT) disposed above the piezoelectric layer. The IDT generally includes a first electrode having a first busbar and a first plurality of fingers. The first electrode generally includes a first copper layer disposed above the piezoelectric layer, a first intermediate layer disposed above the first copper layer, the first intermediate layer comprising a different material than the first copper layer, and a second copper layer disposed above the first intermediate layer.