Electronic module, method for producing an electronic module, and industrial plant
US12082333B2 · kind B2 · utility
0Cited by
2References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 28, 2021 |
| Grant date | Sep 3, 2024 |
| Priority date | — |
| Expiry date | Apr 6, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/83385
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Various embodiments of the teachings herein include an electronic module comprising: a circuit carrier with an electrically conductive thick film with a thickness of at least 0.5 millimeter; and a plurality of thermally conductive elements connected to one another by a thermally conductive material. The thermally conductive elements have a base area with rotational symmetry.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.