Printed circuit board and fabricating method thereof, and displaying device

US12082337B2 · kind B2 · utility

Assignees

• Chengdu BOE Optoelectronics Technology Co., Ltd. · CN
• BOE Technology Group Co., Ltd. · CN

Inventors

• Jiaxiang Zhang · Beijing, CN
• Jiuyuan BAI · Beijing, CN
• Xin Mu · Redwood City, US
• Mingqiang Wang · Beijing, CN
• Hongjin Hu · Beijing, CN
• Fei Li · Nanhu, CN
• Yonglin CHEN · Beijing, CN
• Kun Zuo · Beijing, CN
• Chang Wang · Beijing, CN
• Xin Bi · Beijing, CN
• Bin Zhang · Beijing, CN
• Seungyong OH · Beijing, CN

Key dates

• Filing date: Nov 2, 2021
• Grant date: Sep 3, 2024
• Expiry date: Nov 2, 2041

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K2201/10128
• WIPO field: Audio-visual technology
• WIPO sector: Electrical engineering

Abstract

A printed circuit board and a fabricating method thereof, and a displaying device. The printed circuit board includes a hard-board region (30) and a soft-board region (31), the soft-board region (31) is located at the periphery of the first edge (30a) of the hard-board region (30), the printed circuit board within the hard-board region (30) includes a base plate (301), and an adhesive film (302), a covering film (303) and a first metal layer (304) that are arranged in layer configuration on one side of the base plate (301), the adhesive film (302) is closest to the base plate (301), a flow guiding groove (3030) is disposed on the surface of the side of the covering film (303) that is closer to the adhesive film (302), and the flow guiding groove (3030) extends to a second edge (30b) of the hard-board region (30).