Circuit structure
US12082375B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Nov 6, 2020 |
| Grant date | Sep 3, 2024 |
| Priority date | — |
| Expiry date | Jun 30, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10272
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Provided is a circuit structure with a new structure that can improve a heat dissipation efficiency of a heat generating component while having resistance to a reaction force of a thermally conductive member. Provided is a circuit structure including: a heat generating component; bus bars that are connected to connection portions of the heat-generating component; cases that accommodate the heat-generating component and the bus bars; an elastic thermally conductive member that comes into thermal contact with the bus bars; a pressing portion that is provided on the cases and brings the bus bars into contact with the thermally conductive member; and a reinforcing wall portion that protrudes outside of the cases and reinforces the pressing portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.