Thermally conductive shock absorbers for medical imaging probes
US12082977B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 25, 2022 |
| Grant date | Sep 10, 2024 |
| Priority date | — |
| Expiry date | Jan 25, 2042 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB06B2201/76
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
Systems and methods are provided for thermally conductive shock absorbers for medical imaging probes. An example medical imaging probe may have, at least, a transducer disposed underneath a contact surface of the medical imaging probe, with the transducer configured to transmit and receive signals based on a medical imaging technique; a support structure disposed underneath the transducer; and a thermally conductive shock absorber (TCSA) layer disposed between the transducer and the support structure, with the thermally conductive shock absorber (TCSA) layer is configured to facilitate both of thermal transfer in a direction from the contact surface into the support structure, and absorbing at least a portion of impact force applied to at least the contact surface. The support structure may include a heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.