Laser based machining
US12083620B2 · kind B2 · utility
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Key dates
| Filing date | Dec 20, 2018 |
| Grant date | Sep 10, 2024 |
| Priority date | — |
| Expiry date | Jan 11, 2042 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29D11/00932
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A direct write laser based machining process wherein a laser beam is controlled to machine a glass material in an interlaced raster scan pattern. An embodiment of machining a glass substrate to form an optical element is described. An ultrashort pulsed laser is used for machining and smoothing fused silica, followed by CO2 laser polishing. High speed and high quality machining is possible using this approach, which allows efficient use of high laser repetition rates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.