Polyamide molding compound with low dielectric loss factor
US12084573B2 · kind B2 · utility
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2References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 15, 2021 |
| Grant date | Sep 10, 2024 |
| Priority date | — |
| Expiry date | Jan 20, 2042 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2205/035
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention relates to a thermoplastic molding composition comprising:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.