Semi-passive cooling using hierarchical vasculature
US12085333B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Sep 8, 2020 |
| Grant date | Sep 10, 2024 |
| Priority date | — |
| Expiry date | May 29, 2043 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02T50/60
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A semi-passive cooling system for a component exposed to a fluid flow utilizes a hierarchical vasculature and a sacrificial transpirant to cool the component. The component includes a body that defines a transpirant reservoir and the hierarchical vasculature. The transpirant is configured to transition between a solid phase and a vapor phase over an operating temperature range of the component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.