Sensor device and electronic assembly

US12085526B2 · kind B2 · utility

Assignee

• TDK CORPORATION · JP

Inventors

• Matthias König · Freising, DE
• Matthias Schmidt · Munich, DE
• Markus Mayr · Ehekirchen, DE

Key dates

• Filing date: Aug 7, 2019
• Grant date: Sep 10, 2024
• Expiry date: Feb 23, 2042

Classification

• Technology area (CPC G): Physics
• CPC primary: G01N31/10
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A sensor device and an electronic assembly are disclosed. In an embodiment a sensor device includes a first pellistor element, a second pellistor element, a heater element, a first temperature sensor element and a second temperature sensor element, wherein the heater element and the first temperature sensor element are part of the first pellistor element and the heater element and the second temperature sensor element are part of the second pellistor element.