Semiconductor laser and optical amplifier photonic package
US12085674B2 · kind B2 · utility
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10References
20Claims
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Key dates
| Filing date | May 25, 2022 |
| Grant date | Sep 10, 2024 |
| Priority date | — |
| Expiry date | Oct 4, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/0683
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A light detection and ranging (LIDAR) device includes a first wafer layer, a laser assembly disposed on the first wafer layer, a capping layer, a second wafer layer, and a photonic integrated circuit (PIC). The capping layer is coupled to the first wafer layer and configured to seal the laser assembly. The second wafer layer is at least partially coupled to the first wafer layer. The PIC is formed on the second wafer layer. The second wafer includes an exit feature configured to outcouple laser light from the laser assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.