Semiconductor die, electronic component, electronic apparatus and manufacturing method thereof
US12085976B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 13, 2022 |
| Grant date | Sep 10, 2024 |
| Priority date | — |
| Expiry date | Jan 19, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03L7/08
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A semiconductor die is provided. The semiconductor die includes a D2D transceiver composed of a single die or dual dies. The D2D transceiver includes a first D2D transmitter and a first D2D receiver. The D2D transmitter is configured to send data to a second D2D receiver in a second D2D transceiver of another semiconductor die using a first reference clock signal. The D2D receiver is configured to receive data from a second D2D transmitter in the second D2D transceiver using a second reference clock signal. Through using the embodiments of the disclosure, a transmission solution may be flexibly configured for a multi-application scenario including D2D.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.