Apparatus and methods for determining horizontal position of substrate using lasers
US12087625B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Jul 14, 2022 |
| Grant date | Sep 10, 2024 |
| Priority date | — |
| Expiry date | Jul 14, 2042 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D17/08
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An apparatus for electroplating includes a cup configured to support a substrate, and a cone including at least three distance measuring devices arranged on a lower surface thereof and facing the substrate. Each distance measuring device is configured to transmit a laser pulse towards the substrate, the laser pulse impinging the substrate, receive a reflected laser pulse from the substrate, calculate a turnaround time of the laser pulse, and calculate a distance between the distance measuring device and the substrate using the turnaround time for determining an inclination of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.