Wiring substrate, array substrate and light emitting module having control regions arranged into control region rows and control region columns
US12087698B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jan 28, 2021 |
| Grant date | Sep 10, 2024 |
| Priority date | — |
| Expiry date | Jul 12, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10106
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The present disclosure relates to the field of display technology, and provides a wiring substrate, an array substrate, and a light emitting module. The wiring substrate includes a base substrate, a first metal wiring layer, and an insulating material layer stacked in sequence. The first metal wiring layer is provided with a plurality of drive leads extending along a first direction, and the insulating material layer is provided with a plurality of via holes exposing the drive leads. Through adjusting positions of the drive leads and positions of the via holes, the wiring substrate can be applied to different microchips, and used further to prepare different array substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.