Optical sensor device and method for manufacturing an optical sensor device
US12087780B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 27, 2019 |
| Grant date | Sep 10, 2024 |
| Priority date | — |
| Expiry date | Oct 22, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F77/334
Abstract
An optical sensor device comprises a semiconductor body with a light-sensitive area, metal layers which are arranged above the light-sensitive area and comprise an upper metal layer and a lower metal layer, wherein the upper metal layer is located at a greater distance from the light-sensitive area than the lower metal layer. The optical sensor device further comprises an aperture opening in the metal layers above the light-sensitive area and a via structure, which is arranged outside the aperture opening and interconnects the metal layers and/or the semiconductor body. The via structure is arranged in such a fashion that any straight line that is parallel to the light-sensitive area and traverses the aperture opening between the light-sensitive area and the upper metal layer is limited in both of its opposite directions by the via structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.