Wiring board
US12087988B2 · kind B2 · utility
0Cited by
0References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 21, 2021 |
| Grant date | Sep 10, 2024 |
| Priority date | — |
| Expiry date | Nov 25, 2042 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J2427/18
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A wiring board including a dielectric line containing a resin (A), and a dielectric exterior covering the dielectric line and containing a resin (B). The dielectric exterior has a relative permittivity lower than a relative permittivity of the dielectric line at 6 GHz and 25° C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.