Wireless chip to chip communication with selective frequency multiplexing with different modulation schemes
US12088329B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 23, 2020 |
| Grant date | Sep 10, 2024 |
| Priority date | — |
| Expiry date | Jan 10, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04B2001/0491
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A transmitter for chip to chip communication may include a modulator and a transmit frequency converter. The modulator may modulate a first received signal according to a first modulation scheme. The modulator may also modulate a second received signal according to a second modulation scheme. The transmit frequency converter may center the first received signal on a first frequency that does not comprise a phase within a radio frequency (RF) domain to generate a first centered signal. The transmit frequency converter may also center the second received signal on a second frequency that comprises a phase within the frequency band to generate a second centered signal. The second centered signal may be orthogonal to the first centered signal. A frequency gap may be positioned between the first centered signal and the second centered signal within the frequency band.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.