Micro speaker and diaphragm mold
US12089023B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 4, 2022 |
| Grant date | Sep 10, 2024 |
| Priority date | — |
| Expiry date | Feb 8, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2400/11
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention discloses a micro speaker, including a frame with a containment space, a magnetic circuit system and a vibration system accommodated in the containment space. The vibration system includes a first diaphragm, a dome skeleton fixed to the first diaphragm, and a voice coil fixed on the dome skeleton. A welding plate structure is fixed on the dome skeleton, and a first circuit board and a second circuit board fixed to the frame respectively. The first diaphragm includes a first diaphragm area and a second diaphragm area. The thickness of the first diaphragm area is greater than the thickness of the second diaphragm area. The local thickening material is adopted to avoid the problem of speaker rigidity asymmetry caused by unbalanced heat distribution, so as to realize the stable operation of the speaker, and the manufacturing process is simple.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.