Methods for printing a conductive pillar with high precision
US12089343B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 1, 2022 |
| Grant date | Sep 10, 2024 |
| Priority date | — |
| Expiry date | Sep 1, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1131
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Methods for creating a conductive pillar on a receiver substrate may include forming a dried metal paste pillar by printing metal paste over an area of a receiver substrate, drying the metal paste, and repeating the printing and drying steps. The dried metal paste pillar may be inspected so as to determine a height of the dried metal paste pillar. If the height of the dried metal paste pillar is less than a desired height, additional metal paste may be printed onto to the dried metal paste pillar and dried. If the height of the dried metal paste pillar exceeds the desired height, a portion of the dried metal paste pillar may be ablated. The dried metal paste pillar may be sintered so as to form the conductive pillar. Conductive pillars that are produced according to the methods may be used as part of the formation of a flip-chip assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.