Layered device for pressure treatment and method
US12089344B2 · kind B2 · utility
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1References
24Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 23, 2020 |
| Grant date | Sep 10, 2024 |
| Priority date | — |
| Expiry date | Apr 26, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1121
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A layered device having two base films, a conductive pattern attached to the first base film facing the second base film and a bonding layer binding the first base film and the second base film together. The bonding layer includes an opening, and the conductive pattern having an exposed portion aligned with the opening in the bonding layer. Further disclosed is a spacer attached to the first base film and the exposed portion of the conductive pattern, wherein the spacer fills at least part of the space created by the opening in the bonding layer. Also disclosed is a method of producing a layered device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.