Foot sensor and other sensor pads
US12089952B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 28, 2021 |
| Grant date | Sep 17, 2024 |
| Priority date | — |
| Expiry date | Oct 24, 2042 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61B2562/227
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
The enclosed describes a sensor pad for wearing on a human body. The sensor pad is configured to be in contact with a substrate having a contoured surface, such as a surface of the body. The sensor pad comprises at least a sensor layer and a stiffener layer. The sensor layer comprises a surface area defining a sensing area configured to measure value at a plurality of locations of the sensing area. The stiffener layer is couples to the surface area of the sensor layer. The stiffener layer has a micro-cut pattern to reduce mechanical resistance of the stiffener layer. The micro-cut pattern facilitates the stiffener layer in stretching or compressing in one or more predefined directions, enabling the stiffener lay to conform to the contoured surface of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.