Device and method for processing micro-channel on microfluidic chip using multi-focus ultrafast laser
US12090576B2 · kind B2 · utility
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Key dates
| Filing date | May 25, 2021 |
| Grant date | Sep 17, 2024 |
| Priority date | — |
| Expiry date | May 25, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB01L2300/0874
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for processing a micro-channel of a micro-fluidic chip using multi-focus ultrafast laser, in which an array-type multi-focus femtosecond laser is used to perform fractional ablation on the micro-fluidic chip, and then pulse laser is used to perform secondary ablation on the micro-fluidic chip. Ultrasonic-assisted hydrofluoric acid etching is performed on the micro-fluidic chip after ablation to obtain a true three-dimensional micro-channel on the micro-fluidic chip. A device for processing a micro-channel of a micro-fluidic chip using multi-focus ultrafast laser is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.