Resin composition and article made therefrom
US12091545B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 21, 2023 |
| Grant date | Sep 17, 2024 |
| Priority date | — |
| Expiry date | Jul 21, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/188
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A resin composition includes a core-shell rubber, a vinyl-containing benzoxazine resin and a maleimide resin, wherein the core-shell rubber has a core-shell ratio of 6.0:4.0 to 9.5:0.5. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and achieves improvements in at least one, more or all of the properties including dissipation factor, copper foil peeling strength (3 μm copper foil), ten-layer board T300 thermal resistance, ten-layer board glass transition temperature, ten-layer board delamination temperature, inner resin flow, and resin filling property of open area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.