Vacuum deposition facility and method for coating a substrate
US12091739B2 · kind B2 · utility
0Cited by
8References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 23, 2019 |
| Grant date | Sep 17, 2024 |
| Priority date | — |
| Expiry date | Mar 6, 2041 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/562
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for continuously depositing, on a running substrate, coatings formed from at least one metal inside a vacuum deposition facility including a vacuum chamber, a coated substrate coated with at least one metal and a vacuum deposition facility for the method for continuously depositing on a running substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.