Vacuum deposition facility and method for coating a substrate
US12091744B2 · kind B2 · utility
0Cited by
7References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 23, 2019 |
| Grant date | Sep 17, 2024 |
| Priority date | — |
| Expiry date | Jul 17, 2041 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/24
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for continuously depositing, on a running substrate, coatings formed from at least one metal inside a Vacuum deposition facility including a vacuum chamber, a coated substrate coated with at least one metal on both sides of the substrate and a vacuum deposition facility.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.