Two-phase immersion-type heat dissipation structure having non-vertical fins
US12092406B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 1, 2022 |
| Grant date | Sep 17, 2024 |
| Priority date | — |
| Expiry date | Jun 8, 2043 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28F2215/04
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A two-phase immersion-type heat dissipation structure is provided. The two-phase immersion-type heat dissipation structure includes a heat dissipation substrate and a plurality of non-vertical fins. The heat dissipation substrate has a fin surface and a non-fin surface that face away from each other. The non-fin surface is configured to be in contact with a heating element immersed in a two-phase coolant. The fin surface is connected with the non-vertical fins, a cross-sectional contour of one of the non-vertical fins has a top end point and a bottom end point connected with the fin surface, and the top and bottom end points are opposite to each other. A length of a cross-sectional contour line defined from the top end point to the bottom end point is greater than a perpendicular line length of a perpendicular line defined from the top end point to the fin surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.