Photonic communication platform

US12092867B2 · kind B2 · utility

Assignee

• Lightmatter, Inc. · US

Inventors

• Nicholas C. Harris · Menlo Park, US
• Carl Ramey · Westborough, US
• Michael Gould · La Honda, US
• Thomas Graham · Waretown, US
• Darius Bunandar · Boston, US
• Ryan Braid · Cambridge, US
• Mykhailo Tymchenko · Melrose, US

Key dates

• Filing date: Dec 1, 2023
• Grant date: Sep 17, 2024
• Expiry date: Dec 1, 2043

Classification

• Technology area (CPC H): Electricity
• CPC primary: H04J14/02
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

Described herein are photonic communication platforms that can overcome the memory bottleneck problem, thereby enabling scaling of memory capacity and bandwidth well beyond what is possible with conventional computing systems. Some embodiments provide photonic communication platforms that involve use of photonic modules. Each photonic module includes programmable photonic circuits for placing the module in optical communication with other modules based on the needs of a particular application. The architecture developed by the inventors relies on the use of common photomask sets (or at least one common photomask) to fabricate multiple photonic modules in a single wafer. Photonic modules in multiple wafers can be linked together into a communication platform using optical or electronic means.