Estimating a thickness of cortical region by extracting a plurality of interfaces as mesh data
US12094147B2 · kind B2 · utility
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14Claims
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Key dates
| Filing date | Oct 25, 2021 |
| Grant date | Sep 17, 2024 |
| Priority date | — |
| Expiry date | Nov 19, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30016
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Disclosed is a method for analyzing a thickness of a cortical region, performed by a computing device. The method may include: extracting a plurality of interfaces included in a cortical region based on a mask generated from a medical image including at least one brain region; and estimating a thickness of the cortical region based on the plurality of interfaces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.