Method for providing a three-dimensional printed feedthrough for an implantable medical device
US12094626B2 · kind B2 · utility
0Cited by
9References
20Claims
0Family size
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Key dates
| Filing date | Mar 3, 2023 |
| Grant date | Sep 17, 2024 |
| Priority date | — |
| Expiry date | Mar 3, 2043 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2113/10
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing a ceramic substrate by a 3D-printing process is described. The method comprises operating a 3D-printer to print a green-state ceramic body having a height extending to spaced apart first and second end surfaces and at least one via extending at least part-way along the height of the green-state ceramic body from the first end surface toward the second end surface. Then, the green-state ceramic body is sintered to provide the ceramic substrate with the at least one via. In cross-section, the at least one via has a square-shaped via with rounded corners.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.