Integration of microdevices into system substrate
US12094856B2 · kind B2 · utility
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16References
19Claims
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Key dates
| Filing date | Mar 31, 2021 |
| Grant date | Sep 17, 2024 |
| Priority date | — |
| Expiry date | May 29, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/68381
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a pixelated structure may be provided. The method may comprise providing a donor substrate comprising the plurality of pixelated microdevices, bonding a selective set of the pixelated microdevices from the donor substrate to a system substrate; and patterning a bottom conductive layer of the pixelated microdevices after separating the donor substrate from the system substrate. The patterning may be done by fully isolating the layers or leaving some thin layers between the patterns.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.