Array substrate

US12094888B2 · kind B2 · utility

Assignee

• WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. · CN

Inventors

• Tao Ma · Daguantang, CN
• Yong Xu · 红钢城街道, CN
• Wanglin Wen · 红钢城街道, CN
• Fei AI · 红钢城街道, CN

Key dates

• Filing date: Feb 5, 2021
• Grant date: Sep 17, 2024
• Expiry date: Jan 5, 2043

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10D86/443

Abstract

An array substrate includes a substrate, a first metal layer and an active layer disposed on the substrate, an interlayer insulating layer, and a second metal layer. The first metal layer forms at least one first trace, the interlayer insulating layer is disposed on the first metal layer and the active layer, the second metal layer is disposed on the interlayer insulating layer, the interlayer insulating layer is formed with a first contact hole, and the second metal layer is connected to the first trace through the first contact hole. The first metal layer includes a conductive layer and a first protective layer stacked in sequence.