Electronic device and manufacturing method of the same
US12094996B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jan 13, 2022 |
| Grant date | Sep 17, 2024 |
| Priority date | — |
| Expiry date | Jan 13, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F77/211
Abstract
An electronic device includes a substrate, a plurality of electronic components and a conductive material. The electronic components are arranged on the substrate, and the electronic components respectively include a lower electrode, a semiconductor layer and an upper electrode, and they are sequentially stacked on the substrate. The electronic components share the semiconductor layer, and the semiconductor layer forms a plurality of connecting channels through the semiconductor layer. The connecting channels are located between the upper electrode of the first electronic component in the electronic components and the lower electrode of the second electronic component in the electronic components. These connecting channels are processed by lasers of different powers. The conductive material is arranged in the connecting channel so that the upper electrode of the first electronic component is electrically connected to the lower electrode of the second electronic component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.