Transversely-excited film bulk acoustic resonator package and method
US12095438B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 9, 2021 |
| Grant date | Sep 17, 2024 |
| Priority date | — |
| Expiry date | Oct 9, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H2003/023
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
Acoustic resonator devices and filters are disclosed. An acoustic resonator chip includes a piezoelectric plate attached to a substrate, a portion of the piezoelectric plate forming a diaphragm spanning a cavity in the substrate. A first conductor pattern formed on a surface of the piezoelectric plate includes interleaved fingers of an interdigital transducer on the diaphragm and a first plurality of contact pads. A second conductor pattern is formed on a surface of an interposer, the second conductor pattern including a second plurality of contact pads. Each pad of the first plurality of contact pads is directly connected to a respective pad of the second plurality of contact pads. A seal is formed between a perimeter of the piezoelectric plate and a perimeter of the interposer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.