Transversely-excited film bulk acoustic resonator with reduced substrate to contact bump thermal resistance
US12095443B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 21, 2021 |
| Grant date | Sep 17, 2024 |
| Priority date | — |
| Expiry date | Mar 31, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N30/708
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
An acoustic resonator device with low thermal impedance has a substrate and a single-crystal piezoelectric plate having a back surface attached to a top surface of the substrate via a bonding oxide (BOX) layer. An interdigital transducer (IDT) formed on the front surface of the plate has interleaved fingers disposed on the diaphragm, the overlapping distance of the interleaved fingers defining an aperture of the resonator device. Contact pads are formed at selected locations over the surface of the substrate to provide electrical connections between the IDT and contact bumps to be attached to the contact pads. The piezoelectric plate is removed from at least a portion of the surface area of the device beneath each of the contact pads to provide lower thermal resistance between the contact bumps and the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.