Nanocomposite material for ultraviolet curable direct write semiconductor applications
US12096561B2 · kind B2 · utility
0Cited by
3References
17Claims
0Family size
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Key dates
| Filing date | Nov 1, 2021 |
| Grant date | Sep 17, 2024 |
| Priority date | — |
| Expiry date | May 2, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0248
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A chip-embedded printed circuit board includes a cavity in a printed circuit board, a chip in the cavity of the printed circuit board, and a thixotropic dielectric filler in a gap in the cavity to seal the chip in the printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.