Heat sink assembly and control method for heat sink assembly, and electronic device and manufacturing method for electronic device
US12096599B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jan 8, 2021 |
| Grant date | Sep 17, 2024 |
| Priority date | — |
| Expiry date | Sep 28, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K5/0217
- WIPO fieldEngines, pumps, turbines
- WIPO sectorMechanical engineering
Abstract
The present disclosure relates to a heat sink assembly and control method, and an electronic device and manufacturing method. The heat sink assembly includes: a vibrating plate including a magnetic material; a vibrating film, one end of which is connected with the vibrating plate; a driving device having an electromagnet, which is arranged opposite to the vibrating plate; a control circuit which is connected with the driving device and is configured for transmitting to the driving device a control signal for controlling the electromagnet to be energized and de-energized. The electromagnet generates a magnetic field that drives the vibrating plate to vibrate when the electromagnet is alternately switched between an energized state and a de-energized state. The vibrating film vibrates with the vibration of the vibrating plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.