Electronic device comprising a pressure sensor
US12097692B2 · kind B2 · utility
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11Claims
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Key dates
| Filing date | Jan 20, 2021 |
| Grant date | Sep 24, 2024 |
| Priority date | — |
| Expiry date | Jan 20, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04M2250/12
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An apparatus for use in the assembly of an electronic device, such as a mobile telephone, comprises a pressure sensor. The pressure sensor is embedded within an inner elastic layer and the inner elastic layer is embedded within an outer elastic layer. The inner elastic layer has an elastic modulus which is greater than the elastic modulus of the outer elastic layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.