Method and device for cutting structure composed of brittle material
US12098087B2 · kind B2 · utility
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1References
14Claims
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Assignee
Inventors
Key dates
| Filing date | Dec 11, 2019 |
| Grant date | Sep 24, 2024 |
| Priority date | — |
| Expiry date | Dec 23, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/54
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
This application relates to a method and system for cutting a brittle body. In one aspect, the method includes preparing a brittle body having a rotary shaft. The method may also include forming a scribing line by irradiating laser on the brittle body along a preset route by using a laser irradiation unit. The method may further include cutting the brittle body by bringing a vibration unit that vibrates at a preset frequency in contact with a first region of the brittle body, which is spaced apart from the scribing line.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.