Patent · US Active

United states low dielectric sealing glass powder for miniature radio-frequency glass insulator

US12098096B2 · kind B2 · utility

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Key dates

Filing dateApr 24, 2022
Grant dateSep 24, 2024
Priority date
Expiry dateApr 24, 2042

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC03C2205/00
  • WIPO fieldMaterials, metallurgy
  • WIPO sectorChemistry

Abstract

A low dielectric sealing glass powder for a miniature radio-frequency glass insulator is made of the following raw materials expressed in molar percentages: SiO2: 70.5-74.0%, B2O3: 20.5-23.5%, Ga2O3: 0.5-2.0%, P2O5: 0.25-2.0%, Li2O: 0.4-6.0%, K2O: 0.1-1.5%, LaB6: 0.05-1.0%, and NaCl: 0.03-0.3%. The raw material components are simple, and the preparation method is easy to implement. The dielectric constant and dielectric loss of the prepared glass powder are low, and the melting and molding temperature is low, which are convenient for large-scale industrial production. The melting and molding temperature of the low dielectric sealing glass powder ranges from 1320° C. to 1360° C., and the obtained glass has a dielectric constant ranging from 3.8 to 4.1 and a dielectric loss ranging from 4×10−4 to 10×10−4 at a frequency of 1 MHz, and a sealing temperature ranging from 900° C. to 950° C.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.