United states low dielectric sealing glass powder for miniature radio-frequency glass insulator
US12098096B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 24, 2022 |
| Grant date | Sep 24, 2024 |
| Priority date | — |
| Expiry date | Apr 24, 2042 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC03C2205/00
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A low dielectric sealing glass powder for a miniature radio-frequency glass insulator is made of the following raw materials expressed in molar percentages: SiO2: 70.5-74.0%, B2O3: 20.5-23.5%, Ga2O3: 0.5-2.0%, P2O5: 0.25-2.0%, Li2O: 0.4-6.0%, K2O: 0.1-1.5%, LaB6: 0.05-1.0%, and NaCl: 0.03-0.3%. The raw material components are simple, and the preparation method is easy to implement. The dielectric constant and dielectric loss of the prepared glass powder are low, and the melting and molding temperature is low, which are convenient for large-scale industrial production. The melting and molding temperature of the low dielectric sealing glass powder ranges from 1320° C. to 1360° C., and the obtained glass has a dielectric constant ranging from 3.8 to 4.1 and a dielectric loss ranging from 4×10−4 to 10×10−4 at a frequency of 1 MHz, and a sealing temperature ranging from 900° C. to 950° C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.