Resin composition for plating, and plated molded article
US12098229B2 · kind B2 · utility
0Cited by
6References
15Claims
0Family size
Assignee
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Key dates
| Filing date | Apr 22, 2022 |
| Grant date | Sep 24, 2024 |
| Priority date | — |
| Expiry date | Apr 22, 2042 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D3/38
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
To provide a resin composition for plating and a plated molded article which are excellent in impact resistance and fluidity and which satisfy plating adhesion strength, plating deposition rate and thermal cycle resistance in a well-balanced manner. A resin composition for plating, containing a polycarbonate resin (A), a graft copolymer (B) and a copolymer (C), wherein the resin composition satisfies the following conditions (1) to (5):
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.