Hot-melt pressure-sensitive adhesive composition and hot-melt pressure-sensitive adhesive sheet
US12098311B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 17, 2021 |
| Grant date | Sep 24, 2024 |
| Priority date | — |
| Expiry date | Oct 15, 2041 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2433/00
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Provided is a hot-melt pressure-sensitive adhesive composition which enables to form a pressure-sensitive adhesive layer without allowing the progression of rapid gelation at the time of heating and melting. The pressure-sensitive adhesive composition provided by the present invention is a solvent-free hot-melt pressure-sensitive adhesive composition. The pressure-sensitive adhesive composition includes a base polymer, an isocyanate crosslinking agent, and a tackifier T which is a reaction product of a compound X and a compound Y. A content of the tackifier T with respect to 100 parts by weight of the base polymer is 20 parts by weight or more and 40 parts by weight or less.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.