Promoting adhesion of thin films
US12098459B2 · kind B2 · utility
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1References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 20, 2020 |
| Grant date | Sep 24, 2024 |
| Priority date | — |
| Expiry date | Jul 18, 2040 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C24/04
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The invention relates to a method for adhesion of a thin film or functional layer to a substrate by applying a pulsed and/or alternating voltage.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.