In-situ deposition thickness monitoring
US12098918B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 10, 2021 |
| Grant date | Sep 24, 2024 |
| Priority date | — |
| Expiry date | Dec 18, 2041 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/52
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for in-situ measurement of a thickness of a coating deposited by a deposition process, includes the steps of initiating deposition within a deposition chamber such that a first coating forms on an outer surface of a probe disposed in the deposition chamber, wherein the probe comprises a coil assembly including at least one coil, wherein the probe is separated by a distance from a substrate disposed within the deposition chamber; exciting the coil assembly with a first alternating current to produce a first time-varying magnetic field, the first time-varying magnetic field generating an eddy current in the first coating; determining a metric related to an inductance or resistance of the coil assembly, wherein a value of the metric is related to a first thickness of the first coating and results at least partially from an eddy current magnetic field produced by an eddy current in the coating; and correlating the first thickness of the first coating to a second thickness of a second coating deposited on a surface of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.