Thermal management system for electronic device
US12099386B2 · kind B2 · utility
0Cited by
22References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 23, 2019 |
| Grant date | Sep 24, 2024 |
| Priority date | — |
| Expiry date | May 28, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20209
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Various embodiments relate to a thermal management system for an electronic device, such as an augmented reality or virtual reality device. The thermal management system can comprise an active cooling mechanism in various embodiments to dynamically or actively cool components of the device, for example, by adjust fan speeds of a fan assembly. In some embodiments, a hardware shutdown mechanism can be provided to shut down the device if software-based thermal management devices are inoperable. In some embodiments, the air flow into and/or within the electronic device can be adjusted to cool various components of the device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.