Image stitching for high-resolution scans
US12100117B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 15, 2021 |
| Grant date | Sep 24, 2024 |
| Priority date | — |
| Expiry date | Aug 6, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30184
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A computer-implemented method is disclosed for image stitching for a plurality of digital images of an infrastructure surface for defect detection. The method includes providing a plurality of partial digital images of an infrastructure surface. The method includes extracting global positioning system meta-data from data corresponding to the partial digital images. The method includes determining feature descriptions of features in the one or more partial digital images. The method includes executing a scheduled processing sequence for the partial digital images based on the extracted global positioning system meta-data including determining an affinity matrix using the feature descriptions of adjacent partial digital images to incrementally position each of the partial digital images such that an overview image of the infrastructure surface is produced by iteratively digitally stitching the plurality of partial digital images together.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.