Molded-forming power inductor and manufacturing method thereof
US12100543B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 23, 2021 |
| Grant date | Sep 24, 2024 |
| Priority date | — |
| Expiry date | Mar 10, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01F27/2828
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A molded-forming power inductor comprises a conductor, a magnetic core and a magnetic molding package layer, wherein the conductor comprises an integrally formed insulation-processed base part, an insulation-processed side enclosing part and an electrode part, the base part and the side enclosing part are assembled with the magnetic core in a gapless fit mode, and the magnetic molding package layer is gaplessly wrapped outside the conductor and the magnetic core. A method is provided for manufacturing the molded-forming power inductor. The molding package layer completely covers the prefabricated magnetic core and a part of the conductor except the electrode, the structure is integrally formed, and the leakage magnetic flux is less; when the equivalent magnetic permeability is 60 or more, the equivalent saturation magnetic flux density can be 0.55 T or higher; and the space utilization rate is high to facilitate miniaturization of an inductor design.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.