Electronic device including cooling structure
US12100637B2 · kind B2 · utility
0Cited by
10References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 26, 2021 |
| Grant date | Sep 24, 2024 |
| Priority date | — |
| Expiry date | Apr 8, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10371
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An example electronic device according to various embodiments of the present disclosure includes a housing, a printed circuit board located inside the housing, an electrical element mounted on the printed circuit board, and a shield can that covers the electrical element. A recess area is formed on at least a portion of the shield can, and a metal structure is mounted in the recess area to cool heat generated by the electrical element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.