Multilayer circuit board with LC resonant circuit and electronic component package including multilayer circuit board with LC resonant circuit
US12101074B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 15, 2021 |
| Grant date | Sep 24, 2024 |
| Priority date | — |
| Expiry date | Dec 9, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H2001/0085
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A multilayer circuit board with an LC resonant circuit that has an electronic component package including the multilayer circuit board with the LC resonant circuit are provided. The multilayer circuit board with the LC resonant circuit configured by alternately laminating conductive layers and insulating resin layers on both sides of a core substrate includes a first set of wiring lines, a set of vias, and a second set of wiring lines. The first set of wiring lines configures both ends of the LC resonant circuit and is formed in a first one of the conductive layers. The set of vias extends through the insulating resin layers. The second set of wiring lines is connected to an input/output terminal of the LC resonant circuit and is formed in a second one of the conductive layers. The first set of wiring lines is connected to the second set of wiring lines.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.